Effect of Contact Pressure and Plating Materials on Maximum Temperature, Voltage Drop, and Losses of Copper Busbar Joints

Suwarno Suwarno, Agus Risdiyanto, Umar Khayam

Abstract


This paper reports investigation results on the effects of silver and nickel coating on the contact surface in improving the contact performance in copper conductors. The effect of the pressure on the contact was also investigated. The current used in the investigation is DC current with magnitude of up to 350 A. The measured parameters were maximum temperature, voltage drop, and losses on the contact. Contact resistance was measured using micro ohmmeter and contact temperature was measured using non-contact infra-red thermometer. The coating reduced the contact temperature significantly. Under DC current of 350 A, conductor without contact/joint the steady state temperature was 50oC. For conductor with joint steady state temperature was 55oC for uncoated contact and 55oC for nickel coated contact. The contact temperature reduced to 50oC for silver coated contact. This value is the same as conductor without joint. The losses of bus bar joint with silver plating are lower than ones of bus bar joint without plating. The losses of the bus bar joint with nickel plating are lower than ones of the bus bar joint without plating. The losses of bus bar joint with silver plating are lower than ones of the bus bar joint with nickel plating.


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